U. S. Patents (as inventor or co-inventor)
Patent Number |
Date Issued |
Title |
6,500,321 |
Dec 31, 2002 |
Control of erosion profile and process characteristics in magnetron sputtering by geometrical shaping of the sputtering target.. |
6,497,796 |
Dec 24, 2002 |
Apparatus and method for controlling plasma uniformity across a substrate |
6,444,105 |
Sept 3, 2002 |
Physical Vapor Deposition Reactor Including Magnet to Control Flow of Ions |
6,193,854 B1 |
Feb 27, 2001 |
Apparatus and Method for Controlling Plasma Uniformity Across a Substrate |
6,179,973 B1 |
Jan 30, 2001 |
Apparatus and Method for Controlling Plasma Uniformity Across a Substrate |
5,985,115 |
Nov 16, 1999 |
Internally Cooled Target Assembly for Magnetron Sputtering |
5,503,676 |
Apr 2, 1996 |
Apparatus and Method for Magnetron In-Situ Cleaning of Plasma Reaction Chamber |
5,417,833 |
May 23, 1995 |
Sputtering Apparatus Having a Rotating Magnet Array and Fixed Electromagnets |
4,420,385 |
Dec. 13, 1983 |
Apparatus and Process for Sputter Deposition of Reacted Thin Films |
4,260,649 |
Apr. 7, 1981 |
Laser Induced Dissociative Chemical Gas Phase Processing of Workpieces |
4,204,936 |
May 27, 1980 |
Method and Apparatus for Attaching A Target to the Cathode of a Sputtering System |
4,125,446 |
Nov. 14, 1978 |
Controlled Reflectance of Sputtered Aluminum Layers |